XG-050 Paste Flux 50 g – No-Clean, Acid-Free Rosin Flux for SMD, BGA and IC Soldering

The XG-050 is a 50 g paste flux formulated for precision electronics soldering, particularly on surface-mount and fine-pitch assemblies. It is a no-clean, acid-free flux with a rosin-based composition, which means it removes surface oxidation and improves solder wetting without leaving corrosive residues that require washing. The paste texture allows controlled application to small pads, component leads, and IC pins, making it suitable for SMD, BGA, and mobile board repair where access is tight and excess flux can be difficult to remove. Its anti-corrosion behaviour protects copper and solderable surfaces during heating, and it supports consistent heat transfer from the iron tip to the joint, which helps produce uniform, mechanically sound solder connections.

Because the residue is non-conductive and non-corrosive under normal use, the board can generally be left without cleaning, although local site practices may still call for removal. The product is supplied in a 50 g container and is intended for technicians, repair shops, and electronics builders working on motherboards, phone and tablet boards, and other sensitive circuitry. This XG-050 paste flux is a practical consumable for anyone who needs a controlled, no-clean flux for repeatable hand soldering and rework.

1. Hand soldering and rework of SMD components on printed circuit boards.
2. BGA and fine-pitch IC soldering and reballing support.
3. Mobile phone, tablet, and motherboard repair.
4. General electronics assembly where a no-clean, acid-free flux is preferred.
5. Copper, tin, and iron surfaces requiring oxidation removal before soldering.
6. Repair shops and bench work where controlled paste application is needed.

1. Model: XG-050.
2. Product type: paste soldering flux.
3. Net weight: 50 g.
4. Form: paste / soft ointment consistency.
5. Flux classification: no-clean, acid-free.
6. Base chemistry: rosin-based (rosin synthetic resin per supplier data).
7. Corrosivity: non-corrosive under normal use; anti-corrosion protection on copper and solderable surfaces.
8. Residue: non-conductive and generally removable without mandatory washing.
9. Application method: apply a small amount to the joint with a tool or brush before heating.
10. Suitable surfaces: copper, tin, and iron-plated areas on PCBs and component leads.
11. pH: neutral range (comparable no-clean rosin paste fluxes are specified at pH 7 ± 0.3; the exact value for this batch is not stated on the source page).
12. Insulation resistance and viscosity: not stated on the source page.