XG-40 BGA Soldering Tin Cream [10cc]

Description:
BST-506 Welding Flux Soldering paste Tin Cream [50g] is a tin cream tube (syringe style), that is lead-free and suitable for SMD component soldering function. Solder paste is an adhesive cream or semi-liquid material which is mixed with powder lead or tin soldering materials. This high-density mixture is named solder paste or flux. The flux is developed to act as an impermanent adhesive via doing these three  functions:
Clean the copper of the PCB, component leads, iron head, and so on.
Facilitate smoothly flowing the melted solder
Facilitate adhering the solder to the copper and component lead.
The ingredient material of the Solder past varies and depends on the intended tool and material of soldering such as lead-free, etc. Also, the size of soldering particles (power size) is different and be categorized as type 1, type 2, and so on. Solder pastes can widely be used for mobile phone chips production and repairment, computer or household appliances production and repairment   
The BST-506  solder paste features high quality, tack lasting, easy to change to dry, excellent wetting, high reliability., easy to solder, long shelf life at room temperature, and lead-free flux, which is made of 63 % SN powder and  37% PB powder in flux. The residue of this solder past after soldering operation will be transparent so it does not require cleaning, thus it is suitable for mobile phone repair industry, computer digital repair industry, high precision circuit board SMT soldering, BGA process soldering, etc.

Features:
Model: XG-Z40
Color: Gray
Volume: 10cc
Microns: 25-45um
Material:: 63 %SN, 37%PB
Length: 98mm

Package Include:
1 x XG-40 10CC BGA Soldering Tin Paste Cream