30A 3D printer power module heat sink

the high-power heat bed module is based on a power mosfet and a pid controller, which is used in the motherboards of 3d printers. this module can operate stably for extended periods while measuring i (max) = 30a. the use of a large heat sink for cooling the module, among other features, is part of the key capabilities of this product that has led to the popularity of the heat bed module among users.

application of High power heat module:

1. lerdge motherboard
2. other 3d printer motherboards

specifications of the Power Heatbad Module 3D Printer:

1. maximum current: 30a
2. hole spacing: 62.8 *37.8mm/2.47 *1.49 "
3. supply/operating voltage: 12v-50v (12-24vdc recommended)
4. suitable fan size: 30 mm*30 mm