BST-506 Soldering Tin Cream [50g]

BST-506 Soldering Tin Cream [50g]
  • Product Code:SQ5141
  • Availability: In Stock
  • $1.90
  • Ex Tax:$1.90
This product has a minimum quantity of 4

Tags: Soldering Tin Cream, Welding Paste, Soldering paste, Welding Flux, Solder Flux, BST 506

BST-506 Welding Flux Soldering paste Tin Cream [50g] is a tin cream small can, that is lead-free and suitable for SMD component soldering function. Solder paste is an adhesive cream or semi-liquid material which is mixed with powder lead or tin soldering materials. This high-density mixture is named solder paste or flux. The flux is developed to act as an impermanent adhesive via doing these three  functions:
Clean the copper of the PCB, component leads, iron head, and so on.
Facilitate smoothly flowing the melted solder
Facilitate adhering the solder to the copper and component lead.
The ingredient material of the Solder past varies and depends on the intended tool and material of soldering such as lead-free, etc. Also, the size of soldering particles (power size) is different and be categorized as type 1, type 2, and so on. Solder pastes can widely be used for mobile phone chips production and repairment, computer or household appliances production and repairment   
The BST-506  solder paste is a high quality, high performance, good wettability, strong dry resistance, long shelf life at room temperature, easy to solder, and lead-free flux, which is made of 63 % SN powder and  37% PB powder in flux. The residue of this solder past after soldering operation will be transparent so it does not require cleaning, thus it is suitable for mobile phone repair industry, computer digital repair industry, high precision circuit board SMT soldering, BGA process soldering, and so on.

Brand Name: BEST
Model Number: BST-506
Material: 63 %SN, 37%PB
Melting Point:183℃
Weight: 50g
Size: 30mm x 37mm

Package Include:
1 x 50g BST-506 Welding Paste

Physical Parameters
Size 30mm x 37mm
Weight 50g
Material 63%SN , 37%PB

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