XG-30 Soldering Tin Cream [20g]

Description: 
XG-30 Welding Flux Solder Paste Tin Cream [20g] is a tin cream small can, that is lead-free and suitable for SMD component soldering function. Solder paste is an adhesive cream or semi-liquid material which is mixed with powder lead or tin soldering materials. This high-density mixture is named solder paste or flux. The flux is developed to act as an impermanent adhesive via doing these three  functions:
Clean the copper of the PCB, component leads, iron head, and so on.
Facilitate smoothly flowing the melted solder
Facilitate adhering the solder to the copper and component lead.
The ingredient material of the Solder past varies and depends on the intended tool and material of soldering such as lead-free, etc. Also, the size of soldering particles (power size) is different and be categorized as type 1, type 2, and so on. Solder pastes can widely be used for mobile phone chips production and repairment, computer or household appliances production and repairment   
The XG-30 solder paste is a high quality, high performance, easy to solder, and lead-free flux, which is made of 63 % SN powder and  37% PB powder in flux. The residue of this solder past after soldering operation will be transparent so it does not require cleaning, thus it is suitable for wave soldering machines, reflow soldering machines, tin furnaces, etc, that generally applied in electronics production lines or semi-finished products processing plants. 

Features:
Model: XG-30
Material: 63 %SN, 37%PB
Weight: 20g
Size: 35mm x 20mm (DxH)

Package Include:
1 x  20g XG-30 Solder Welding Paste