0.45mm Reballing Solder Balls

In integrated circuit packaging, a solder ball is a tin sphere that creates the connection between the chip package and the printed circuit board. A 0.45mm solder ball can be precisely placed using automated or manual equipment with tacky flux.

Sometimes, solder balls undergo coin pressing to increase their contact surface area, enhancing their strength. These small tin spheres are commonly used for mounting and soldering various BGA ICs.

This bottle contains approximately 25,000 pieces of 0.45mm solder balls (also referred to as 0.45mm solder spheres, 0.45mm tin spheres, or tin balls), each with a diameter of 0.45mm. Using these 0.45mm tin spheres requires a solder pot.

Applications of the 0.45mm solder ball

1. BGA chip assembly
2. Integrated circuit manufacturing
3. IC Swap

Specifications of the 0.45mm solder ball

1. Approximate quantity per bottle: 25,000 pieces
2. Diameter of each solder ball: 0.45mm
3. Total weight including bottle: 12 grams