0.25mm Reballing Solder Balls

In integrated circuit packaging, a solder ball is a tin sphere that establishes electrical and mechanical connections between the chip package and the printed circuit board. A 0.25mm solder ball (also referred to as a 0.25mm solder sphere, 0.25mm tin ball, or 0.25mm tin sphere) can be placed precisely using either automated or manual equipment with the help of tacky flux.

Sometimes, solder balls undergo coin pressing to increase their contact surface area, thereby improving their mechanical strength. These small tin spheres are widely used for mounting and soldering various BGA ICs.

This product is a bottle containing 25,000 pieces of 0.25mm solder balls, each tin sphere measuring 0.25mm in diameter, designed for use with a solder pot.

Applications of the 0.25mm solder ball

1. BGA IC Assembly
2. Integrated Circuit Packaging
3. IC Swap

Specifications of the 0.25mm solder ball

1. Quantity per bottle: 25,000 pieces
2. Diameter of each solder ball: 0.25mm
3. Total weight including bottle: 6 grams