Solder Ball Bottle 0.35mm 9g
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- Product Code:SQ11432
- Availability: 1000
- $1.30
- Ex Tax:$1.30
A Solder ball 0.35mm is a tin ball that makes contact between the chip packaging and the printed circuit board. The solder ball can be placed in place using automatic or manual devices using sticky flux.
Solder pellets in the form of small tin balls are also used for assembling and soldering all types of BGA ICs.
This product is a bottle of 25,000 pieces of 0.35mm solder balls, each ball or tin wing has a diameter of 0.35mm and requires a solder bath to use.
Application of 0.35mm Tin Sphere :
- BGA IC assembly
- Integrated circuits
Specifications of 0.35mm tin sphere :
- Number of lead balls in the bottle: 25,000 pieces
- Diameter of solder ball: 0.35 millimeters